Your Contract Manufacturing Partner...
At Novatronix we utilize leading-edge manufacturing technologies to offer integrated turnkey solutions along with cosigned and kitted assemblies. We provide advanced PCB assembly solutions at our US-based lean manufacturing facility and we continue to make significant investments in order to obtain the latest equipment which includes: high quality SMT lines, wave solder ovens, selective solder, AOI, and X-Ray inspection. Our multiple assembly lines are capable of performing high-mix, densely populated component placement with quickness and accuracy and with little to no fallout. Our sophisticated high-speed equipment employs Statistic Process Control (SPC) and real-time product tracking, ensuring the manufacturing efficiency that result in on-time delivery. In addition to our US-based facility, we also have the overseas global production capabilities to meet your manufacturing needs. When it comes to assembly, we can handle everything from:
- Fine Pitch SMT & BGA Assembly
- Automated Through Hole & Mixed Technology Assembly
- Automated Selective Soldering
- RoHS Compliant Lead Free Assembly
- Flex & Rigid Flex Assembly
- In Circuit Testing
- Functional Testing
- Conformal Coating & Potting
- Box Build & System Integration
SMT Placement
Our Juki KE2060 component placement systems offer the latest technology, giving us accuracy and reliability in bare board component placement. Ranging from package sizes as small as 01005 to as large as 150mm, we have a wide range of component and board handling options not available elsewhere. Its high-precision vision centering and laser alignment system gives it the ability to place components with a 0.001" accuracy at a rate of 12,500 components per hour.
- Performs high mix assemblies at high speeds
- Continuous production and short batch capability
- Great accuracy and flexibility
- Fast setups and changeovers
- Places components as small as 01005
- Places BGA's and Micro BGA's
- Capable of placing 12,500 components per hour
Selective Solder
The KISS-103 is an automated selective
soldering machine is designed to solder components such as connectors
and through hole parts to printed circuit boards, panels, and other assemblies
without disturbing nearby SMT components, and overcomes the limitations
of operator-dependent soldering while significantly increasing the solder joint
quality.
Coupling high throughput with precise process
controls, it provides the tools necessary to solder with an accuracy of +/- 0.002".
- Selectively solders Through-Hole components
- Significantly superior to hand soldering
- Provides a consistently excellent solder wave shape
- Accuracy of +/- 0.002"
- Eliminates icicles and solder bridges
- Process up to 18" x 48" PCB panel size
- Tin/Lead and RoHS compatible
- Capable of handling fine-pitch gold plated QFP's
X-Ray Inspection
Our high-resolution Scienscope X-Ray allows complete inspection of critical hidden features and solder
joints in SMT and semiconductor packages, components under radio frequency (RF) shields,
PCB's, and other assemblies. Its newly available
image processing technology integrates several techniques and inspection algorithms
to provide complete inspection coverage with an extremely low false failure rate.
The system is effective for complicated boards populated with BGA's, column grid arrays (CGAs),
chip-scale packages (CSPs), and other advanced packages, detecting insufficient solder,
voiding, shorts and opens, in areas that are not visible.
Remote programming and real-time statistical process control (SPC) software
are designed to enhance yields.
- Inspect electronic and sealed assemblies.
- Process up to 18" x 20" PCB panel size.
- Inspects visible and hidden solder-joints.
- Detects BGA shorts, voids, position, and missing balls
- Inspects component packages as small as 0201 and 01005
- Flip Chip inspection
Automated Optical Inspection
With two top-down viewing cameras and four side viewing cameras,
our advanced YesTech F1 series AOI machine inspects solder-joints
and verifies correct part assembly, enabling us to ensure our high
level of quality and also increase throughput. Its advanced Thin-Camera
technology offers high-speed PCB inspection and exceptional defect coverage integrating
several newly available techniques. It is equally effective for bare PCB,
past, pre/post-reflow, and final assembly inspection giving us a full,
complete inspection solution.
On final assemblies, our AOI machine checks that
all components are positioned in their correct locations. It also checks
for quality defects such as incorrect skew, tombstoning, bent leads, lifted pads,
and solder bridging. It has a throughput of up to 5 sq.in/sec on a maximum board size
of 22" x 20". It is also capable of inspecting components with package sizes as
small as 0201 and 01005 at a rate of 250,000 per hour.
