Your Contract Manufacturing Partner...

At Novatronix, we understand that there is a wide assortment of unknowns when it comes to procuring Printed Circuit Boards. Old and out-dated equipment, lack of expertise, outsourcing of services & processes, and low quality standards can jeopardize the integrity and functionality the PCB. Many brokers and contract manufacturers solely buy based on price, making them "Penny Wise," but when their final assemblies fail due to defects on the bare circuit board, they find themselves "Pound Foolish."

Novatronix avoids these scenarios by implementing well-proven procedures and guidelines to analyze our PCB fabricator’s equipment, capabilities, and expertise. We routinely perform micro-section & micro-etching analysis, as well as solderability and dimensional measurement testing to make sure that our PCB's meet IPC's structural integrity and acceptance criteria. These tests find and evaluate voids, cracks, burrs, wicking, delaminating, blistering, plating & dielectric thickness, as well as other structural defects. We also perform IPC's Qualification Profile with our suppliers, covering every detail relating to their processes, machinery, capabilities, and quality programs. Our PCB fabricators can facilitate:

  • - Quick Turn Production
  • - Small Prototype Runs
  • - Medium & High Volume Production Runs
  • - RoHS Compliant Boards
  • - Domestic Manufacturing
  • - Overseas Manufacturing
  • - IPC Class II & III quality
  • - Military & ITAR Certified Production

Materials & Capabilities

Board Types

  • Rigid (1 – 16 Layers)
  • Flex
  • Rigid-flex
  • RF / Microwave
  • Metal Core & Heat Sink

Laminate Materials

  • Isola & Equivalent Materials: FR4, FR406, FR408, IS410, HR370
  • Teflon, Rogers, Arlon, Taconic, Nelco
  • Polyimide, Kapton
  • Duroid, Thermagon
  • Getek, CEM-1, CEM-3

Plating Finishes

  • HASL
  • Lead-Free HASL
  • Immersion Tin (White Tin)
  • Immersion Silver
  • Immersion Gold (ENIG)
  • Electrolytic Gold (Hard Gold)
  • Selective Gold
  • Carbon Ink
  • OSP

Solder Mask Types

  • LPI,
  • Peelable Mask,
  • Multiple Colors: Green, Red, Blue, Black, Clear, Purple, White

Silk Screen

  • White
  • Yellow
  • Black
  • Red
  • Orange
  • Blue

Minimum Capabilities

  • Min. Trace / Space: .003”
  • Layer to Layer Registration: +/-.003”
  • Maximum PCB thickness: .300”
  • Minimum Dielectric Thickness: .0015”
  • Minimum Plated Hole Size: .006”
  • Minimum Laser Drilled Hole Size: .002”
  • Maximum Copper Weight: 6oz

Additional Capabilities

  • Impedance Control
  • Blind & Buried Vias
  • Conductive & Nonconductive Via Fill, Via Plug, Via Cap
  • Electrical Testing
  • Controlled Depth Drilling & Controlled Depth Milling